TM

Takao Miwa

HI Hitachi: 3 patents #256 of 3,189Top 9%
HO Hoya: 1 patents #17 of 87Top 20%
Overall (2005): #9,096 of 245,428Top 4%
4
Patents 2005

Issued Patents 2005

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
6933601 Semiconductor connection substrate Toshiya Satoh, Masahiko Ogino, Takashi Naitou, Takashi Namekawa 2005-08-23
6930140 Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof Satoru Amou, Shinji Yamada, Takao Ishikawa 2005-08-16
6878448 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same Toshiaki Ishii, Hiroyoshi Kokaku, Akira Nagai 2005-04-12
6845635 METHOD OF MANUFACTURING GLASS SUBSTRATE FOR INFORMATION RECORDING MEDIA, GLASS SUBSTRATE FOR INFORMATION RECORDING MEDIA MANUFACTURED USING THE METHOD, AND INFORMATION RECORDING MEDIUM USING THE GLASS SUBSTRATE Takeo Watanabe, Satoshi Jibiki, Masamichi Kezuka, Kensuke Matsuno 2005-01-25