Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6902955 | Method of manufacturing a semiconductor device having a flexible wiring substrate | — | 2005-06-07 |
| 6897093 | Method of manufacturing a resin molded or encapsulation for small outline non-leaded (SON) or quad flat non-leaded (QFN) package | Takahiro Kasuga, Kazuo Tasaka | 2005-05-24 |