Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6932924 | Method and apparatus for mold clamping in an injection molding machine and the like | Makoto Nishizawa, Toshihiro Kasai, Yukio Iimura | 2005-08-23 |
| 6876014 | Interconnection structure of a semiconductor device | Yuzo Fukuzaki | 2005-04-05 |