Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6869665 | Wiring board with core layer containing inorganic filler | Nobuyuki Hayashi, Tomoyuki Abe, Yasuhito Takahashi, Yoshiyasu Saeki | 2005-03-22 |
| 6846549 | Multilayer printed wiring board | Nobuyuki Hayashi, Hiroyuki Machida, Takeshi Ishitsuka, Yasuo Yamagishi | 2005-01-25 |