Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6967399 | Semiconductor device manufacturing method having a step of applying a copper foil on a substrate as a part of a wiring connecting an electrode pad to a mounting terminal | Yoshitaka Aiba | 2005-11-22 |
| 6909181 | Light signal processing system | Yoshitaka Aiba, Hirohisa Matsuki | 2005-06-21 |
| 6905951 | Method of forming a device substrate and semiconductor package including a pyramid contact | Yoshiyuki Yoneda, Masaharu Minamizawa, Eiji Watanabe | 2005-06-14 |