Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6972487 | Multi chip package structure having a plurality of semiconductor chips mounted in the same package | Yoshiharu Kato, Satoru Kawamoto, Tetsuya Hiraoka, Akira Takashima | 2005-12-06 |