RH

Reiji Higuchi

FU Fujikura: 2 patents #14 of 113Top 15%
Overall (2005): #38,404 of 245,428Top 20%
2
Patents 2005

Issued Patents 2005

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6914199 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof Shouji Itou, Osamu Nakao 2005-07-05
6914200 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof Shouji Itou, Osamu Nakao 2005-07-05