Issued Patents 2005
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6958261 | Optical sensor package | Man Hon Cheng, Wai Keung Ho | 2005-10-25 |
| 6949816 | Semiconductor component having first surface area for electrically coupling to a semiconductor chip and second surface area for electrically coupling to a substrate, and method of manufacturing same | Clem H. Brown, Frank J. Mosna, Jr. | 2005-09-27 |
| 6917097 | Dual gauge leadframe | Zhi-Gang Bai, Clem H. Brown | 2005-07-12 |
| 6905910 | Method of packaging an optical sensor | Hei Ming Shiu, Kam Lee | 2005-06-14 |
| 6875635 | Method of attaching a die to a substrate | Man Hon Cheng, Wai Keung Ho | 2005-04-05 |
| 6867072 | Flipchip QFN package and method therefor | Hei Ming Shiu, Qing-Chun He | 2005-03-15 |
| 6838751 | Multi-row leadframe | Man Hon Cheng, Fei Ying Wong | 2005-01-04 |