Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6930032 | Under bump metallurgy structural design for high reliability bumped packages | Owen R. Fay, Lizabeth Keser | 2005-08-16 |
| 6888246 | Semiconductor power device with shear stress compensation | Lei Mercado, Young Sir Chung, James Jen-Ho Wang, Edward R. Prack | 2005-05-03 |