Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6953985 | Wafer level MEMS packaging | Jong-Kai Lin, William H. Lytle, Owen R. Fay, Henry G. Hughes, Craig Amrine +1 more | 2005-10-11 |
| 6949398 | Low cost fabrication and assembly of lid for semiconductor devices | William H. Lytle, Owen R. Fay, Stephen Springer | 2005-09-27 |