Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6977187 | Chip package sealing method | Brian Farrell, Paul Jaynes | 2005-12-20 |
| 6952046 | Electronic and optoelectronic component packaging technique | Brian Farrell, Paul Jaynes | 2005-10-04 |