Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6891257 | Packaging system for die-up connection of a die-down oriented integrated circuit | David Chong, Hun Kwang Lee, Stephen R. Martin | 2005-05-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6891257 | Packaging system for die-up connection of a die-down oriented integrated circuit | David Chong, Hun Kwang Lee, Stephen R. Martin | 2005-05-10 |