Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6890635 | Low loss dielectric material for printed circuit boards and integrated circuit chip packaging | Pui-Yan Lin, Govindasamy Rajendran | 2005-05-10 |
| 6866930 | Polyamide chain extension process and functionalized polyamides produced thereby | — | 2005-03-15 |