Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6923924 | Copper particle clusters and powder containing the same suitable as conductive filler of conductive paste | Yoshihiro Okada, Hiromasa Miyoshi, Yoshiomi Takada | 2005-08-02 |
| 6881240 | Copper powder for electrically conductive paste | Yoshihiro Okada, Hiromasa Miyoshi | 2005-04-19 |
| 6875252 | Copper powder and process for producing copper powder | Yoshihiro Okada, Hiromasa Miyoshi, Yoshiomi Takada | 2005-04-05 |