Byoung Young Kang

DC Dongbu Electronics, Co.: 2 patents #2 of 18Top 15%

📍 Seoul, KR: #173 of 1,497 inventorsTop 15%

Overall (2005): #61,531 of 245,428Top 30%

Patents 2005

Issued Patents 2005

Showing 1–2 of 2 patents

Patent #	Title	Co-Inventors	Date
6953710	Method for packaging a semiconductor device	—	2005-10-11
6836961	Ceramic packaging method employing flip-chip bonding	—	2005-01-04