Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6955930 | Method for determining thickness of a semiconductor substrate at the floor of a trench | Erwan Le Roy | 2005-10-18 |
| 6939209 | Method and apparatus for global die thinning and polishing of flip-chip packaged integrated circuits | John Valliant | 2005-09-06 |
| 6872581 | Measuring back-side voltage of an integrated circuit | Christopher Shaw, Theodore Lundquist | 2005-03-29 |