Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6897549 | Frame for semiconductor package | Kouji Tomita | 2005-05-24 |
| 6882048 | Lead frame and semiconductor package having a groove formed in the respective terminals for limiting a plating area | Kouji Tomita | 2005-04-19 |