Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6975513 | Construction for high density power module package | Chin-Hsiung Liao | 2005-12-13 |
| 6972479 | Package with stacked substrates | Tung Yi Yang, Steven Liu | 2005-12-06 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6975513 | Construction for high density power module package | Chin-Hsiung Liao | 2005-12-13 |
| 6972479 | Package with stacked substrates | Tung Yi Yang, Steven Liu | 2005-12-06 |