Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6869836 | ILD stack with improved CMP results | Han-Ti Hsiaw, Shwang-Ming Jeng, Fu-Chi Hsu | 2005-03-22 |
| 6863796 | Method for reducing cu surface defects following cu ECP | Chia-Liang Chueh, Volume Chien | 2005-03-08 |