Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6972481 | Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packages | — | 2005-12-06 |
| 6967126 | Method for manufacturing plastic ball grid array with integral heatsink | TaeKeun Lee, Flynn Carson | 2005-11-22 |
| 6933598 | Semiconductor stacked multi-package module having inverted second package and electrically shielded first package | — | 2005-08-23 |
| 6906416 | Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package | — | 2005-06-14 |
| 6838761 | Semiconductor multi-package module having wire bond interconnect between stacked packages and having electrical shield | — | 2005-01-04 |