Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6949408 | Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps | Charles W. C. Lin | 2005-09-27 |
| 6936495 | Method of making an optoelectronic semiconductor package device | — | 2005-08-30 |
| 6908794 | Method of making a semiconductor package device that includes a conductive trace with recessed and non-recessed portions | — | 2005-06-21 |
| 6891276 | Semiconductor package device | — | 2005-05-10 |
| 6846735 | Compliant test probe with jagged contact surface | Charles W. C. Lin | 2005-01-25 |