CH

Chia-Ming Hsieh

BE Benq: 1 patents #47 of 125Top 40%
📍 Gongguan, TW: #3 of 15 inventorsTop 20%
Overall (2005): #224,937 of 245,428Top 95%
1
Patents 2005

Issued Patents 2005

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6947295 Ball grid array package with an electromagnetic shield connected directly to a printed circuit board — 2005-09-20