KS

Keh Chin Seah

AT Agilent Technologies: 1 patents #220 of 799Top 30%
Overall (2005): #158,850 of 245,428Top 65%
1
Patents 2005

Issued Patents 2005

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6967123 Adhesive die attachment method for a semiconductor die and arrangement for carrying out the method Kee Yean Ng, Chong Hai Lee 2005-11-22