Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6900654 | Method and apparatus for evaluating a known good die using both wire bond and flip-chip interconnects | Steve M Danziger | 2005-05-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6900654 | Method and apparatus for evaluating a known good die using both wire bond and flip-chip interconnects | Steve M Danziger | 2005-05-31 |