YW

Ying Wang

KL Kla-Tencor: 1 patents #2 of 31Top 7%
📍 Singapore, IL: #3 of 5 inventorsTop 60%
Overall (2005): #72,265 of 245,428Top 30%
1
Patents 2005

Issued Patents 2005

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6924484 Void characterization in metal interconnect structures using X-ray emission analyses Anne Testoni 2005-08-02