Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6953988 | Semiconductor package | Seong Min Seo, Young Suk Chung, Jae Hun Ku, Jae Hak Yee | 2005-10-11 |
| 6927478 | Reduced size semiconductor package with stacked dies | — | 2005-08-09 |
| 6858919 | Semiconductor package | Seong Min Seo, Young Suk Chung, Jae Hun Ku, Jae Hak Yee | 2005-02-22 |
| 6846704 | Semiconductor package and method for manufacturing the same | — | 2005-01-25 |
| 6841874 | Wafer-level chip-scale package | In Bae Park, Seong Min Seo | 2005-01-11 |