KC

Kong Hoong Chew

AT Agilent Technologies: 1 patents #220 of 799Top 30%
📍 Bayan Lepas, MY: #1 of 2 inventorsTop 50%
Overall (2005): #156,526 of 245,428Top 65%
1
Patents 2005

Issued Patents 2005

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6858474 Wire bond package and packaging method Hean Tatt Koay, Beng Huat Low 2005-02-22