Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6949826 | High density semiconductor package | — | 2005-09-27 |
| 6936930 | Thermal enhance MCM package | — | 2005-08-30 |
| 6879031 | Multi-chips package | — | 2005-04-12 |
| 6861761 | Multi-chip stack flip-chip package | Chaur-Chin Yang | 2005-03-01 |