Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6974334 | Semiconductor package with connector | — | 2005-12-13 |
| 6927480 | Multi-chip package with electrical interconnection | Bau-Nan Lee, Cheng-Fen Chen, Chih-Wei Tsai | 2005-08-09 |
| 6864588 | MCM package with bridge connection | — | 2005-03-08 |
| 6844617 | Packaging mold with electrostatic discharge protection | Juang-Sheng Chiang | 2005-01-18 |