Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6967403 | Package structure with a heat spreader and manufacturing method thereof | Chih-Min Pao, Chien Liu, Chi-Hao Chiu | 2005-11-22 |
| 6929980 | Manufacturing method of flip chip package | Chi-Hao Chiu, Yu-Wen Chen, Chi-Sheng Chao | 2005-08-16 |