Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6951803 | Method to prevent passivation layer peeling in a solder bump formation process | Cheng-Ming Wu, Chu-Wei Hu, Jung-Lieh Hsu, Kuei-Yuam Hsu | 2005-10-04 |
KT
Kai-Meng Tzeng
Overall (2005): #161,976 of 245,428Top 70%
1
Patents 2005