Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6740540 | Fabrication method for circuit board | Jin-Chuan Bai | 2004-05-25 |
| 6713856 | Stacked chip package with enhanced thermal conductivity | Wei Shan | 2004-03-30 |
| 6713857 | Low profile stacked multi-chip semiconductor package with chip carrier having opening and fabrication method of the semiconductor package | — | 2004-03-30 |
| 6709894 | Semiconductor package and method for fabricating the same | Wei Shan, Huan-Ping Su | 2004-03-23 |
| 6683385 | Low profile stack semiconductor package | Wei Shan | 2004-01-27 |