Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6713856 | Stacked chip package with enhanced thermal conductivity | Chung-Che Tsai | 2004-03-30 |
| 6709894 | Semiconductor package and method for fabricating the same | Chung-Che Tsai, Huan-Ping Su | 2004-03-23 |
| 6683385 | Low profile stack semiconductor package | Chung-Che Tsai | 2004-01-27 |