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Tri-Rung Yew

UM United Microelectronics: 2 patents #26 of 270Top 10%
Overall (2004): #36,549 of 270,089Top 15%
2
Patents 2004

Issued Patents 2004

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6794752 Bonding pad structure Ellis Lee, Yimin Huang 2004-09-21
6680248 Method of forming dual damascene structure Yimin Huang 2004-01-20