YH

Yimin Huang

UM United Microelectronics: 2 patents #26 of 270Top 10%
📍 Hsinchu, SC: #1 of 1 inventorsTop 100%
Overall (2004): #34,056 of 270,089Top 15%
2
Patents 2004

Issued Patents 2004

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6794752 Bonding pad structure Ellis Lee, Tri-Rung Yew 2004-09-21
6680248 Method of forming dual damascene structure Tri-Rung Yew 2004-01-20