Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6749737 | Method of fabricating inter-layer solid conductive rods | Chang-Chin Hsieh, Chih-Peng Fan, Chih-Hao Yeh | 2004-06-15 |
| 6709897 | Method of forming IC package having upward-facing chip cavity | Chih-Peng Fan, David C. H. Cheng | 2004-03-23 |
| 6673652 | Underfilling method for a flip-chip packaging process | Ming-Hsien Chen | 2004-01-06 |