MC

Ming-Hsien Chen

AT Amic Technology: 1 patents #2 of 4Top 50%
Overall (2004): #155,336 of 270,089Top 60%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6673652 Underfilling method for a flip-chip packaging process Jao-Chin Cheng 2004-01-06