AI

Akira Ichida

TC Tokyo Tungsten Co.: 1 patents #1 of 8Top 15%
📍 Toyama, JP: #45 of 145 inventorsTop 35%
Overall (2004): #266,260 of 270,089Top 100%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6693353 Semiconductor package and method for producing heat-radiating substrate for it Norio Hirayama, Mitsuo Osada, Yoshinari Amano, Kiyoshi Asai, Hidetoshi Maesato +2 more 2004-02-17