Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6693353 | Semiconductor package and method for producing heat-radiating substrate for it | Norio Hirayama, Mitsuo Osada, Akira Ichida, Kiyoshi Asai, Hidetoshi Maesato +2 more | 2004-02-17 |