Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6822327 | Flip-chip interconnected with increased current-carrying capability | Pankaj Mithal, William D. Higdon, Mark W. Gose, John Mark Dikeman | 2004-11-23 |
| 6811892 | Lead-based solder alloys containing copper | Shing Yeh, Bradley H. Carter, Scott D. Brandenburg | 2004-11-02 |
| 6802446 | Conductive adhesive material with metallurgically-bonded conductive particles | Arun K. Chaudhuri, Matthew R. Walsh | 2004-10-12 |