Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6811892 | Lead-based solder alloys containing copper | Shing Yeh, Frank Stepniak, Scott D. Brandenburg | 2004-11-02 |
| 6767411 | Lead-free solder alloy and solder reflow process | Shing Yeh, Curtis W. Melcher | 2004-07-27 |