Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6754405 | Electronic assembly having high interconnection density | Marc Huan, Sylvain Paineau | 2004-06-22 |
| 6730997 | Method of transferring ultra-thin substrates and application of the method to the manufacture of a multi-layered thin film device | Eric Beyne, Augustin Coello-Vera | 2004-05-04 |
| 6683373 | Method of modifying connecting leads and thinning bases of encapsulated modular electronic components to obtain a high-density module, and a module obtained thereby | Norbert Venet, Philippe Calvel, Stéphane Albinet, Jean-Cyril Esther, Marc Huan | 2004-01-27 |