Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6754405 | Electronic assembly having high interconnection density | Olivier Vendier, Sylvain Paineau | 2004-06-22 |
| 6683373 | Method of modifying connecting leads and thinning bases of encapsulated modular electronic components to obtain a high-density module, and a module obtained thereby | Olivier Vendier, Norbert Venet, Philippe Calvel, Stéphane Albinet, Jean-Cyril Esther | 2004-01-27 |