Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6828660 | Semiconductor device with double nickel-plated leadframe | — | 2004-12-07 |
| 6724070 | Fine pitch lead frame | Robert M. Fritzsche | 2004-04-20 |
| 6713852 | Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin | Douglas W. Romm | 2004-03-30 |
| 6706561 | Method for fabricating preplated nickel/palladium and tin leadframes | — | 2004-03-16 |
| 6683380 | Integrated circuit with bonding layer over active circuitry | Taylor R. Efland, Walter Bucksch, Marco Corsi, Chi-Cheong Shen, John P. Erdeljac +5 more | 2004-01-27 |