Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6787926 | Wire stitch bond on an integrated circuit bond pad and method of making the same | Chih-Chiang Chen, Chung Yu Wang | 2004-09-07 |
| 6782897 | Method of protecting a passivation layer during solder bump formation | Chung Yu Wang, Chender Huang, Ken-Ching Chen, Hank Huang | 2004-08-31 |
| 6774026 | Structure and method for low-stress concentration solder bumps | Chung Yu Wang, Chender Huang, Ken-Ching Chen, Hank Huang | 2004-08-10 |
| 6770958 | Under bump metallization structure | Chung Yu Wang, Chender Huang, Ken-Ching Chen, Hank Huang | 2004-08-03 |