Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6782897 | Method of protecting a passivation layer during solder bump formation | Chung Yu Wang, Chender Huang, Pei-Haw Tsao, Ken-Ching Chen | 2004-08-31 |
| 6774026 | Structure and method for low-stress concentration solder bumps | Chung Yu Wang, Chender Huang, Pei-Haw Tsao, Ken-Ching Chen | 2004-08-10 |
| 6770958 | Under bump metallization structure | Chung Yu Wang, Chender Huang, Pei-Haw Tsao, Ken-Ching Chen | 2004-08-03 |