HO

Hitoshi Okuda

SS Sumitomo Mitsubishi Silicon: 1 patents #10 of 35Top 30%
Overall (2004): #208,561 of 270,089Top 80%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6830985 Method and apparatus for producing bonded dielectric separation wafer Hiroyuki Oi 2004-12-14