Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6830985 | Method and apparatus for producing bonded dielectric separation wafer | Hitoshi Okuda | 2004-12-14 |
| 6815774 | Dielectrically separated wafer and method of the same | Kazuya Sato, Hiroshi Shimamura | 2004-11-09 |