Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6835600 | Lead frame and method for fabricating resin-encapsulated semiconductor device using the same | Masaki Utsumi, Masashi Funakoshi, Takeshi Morikawa, Yukio Nakabayashi | 2004-12-28 |
| 6693358 | Semiconductor chip, wiring board and manufacturing process thereof as well as semiconductor device | Yuichiro Yamada | 2004-02-17 |