Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6835600 | Lead frame and method for fabricating resin-encapsulated semiconductor device using the same | Masaki Utsumi, Masashi Funakoshi, Tsuyoshi Hamatani, Takeshi Morikawa | 2004-12-28 |